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| DATA SHEET BIPOLAR DIGITAL INTEGRATED CIRCUIT PPB1509GV 1GHz INPUT DIVIDE BY 2, 4, 8 PRESCALER IC FOR PORTABLE SYSTEMS PPB1509GV is a divide by 2, 4, 8 prescaler IC for portable radio or cellular telephone applications. PPB1509GV is a shrink package version of PPB587G so that this small package contributes to reduce the mounting space. PPB1509GV is manufactured using NEC's high fT NESATTM IV silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability. FEATURES x High toggle frequency : fin = 50 MHz to 700 MHz @ y 2, 50 MHz to 800 MHz @ y 4, 50 MHz to 1000 MHz @ y 8 x Low current consumption x High-density surface mounting x Supply voltage x Selectable division : 5.0 mA @ VCC = 3.0 V : 8 pin plastic SSOP (175mil) : VCC = 2.2 to 5.5 V : y 2, y 4, y 8 APPLICATION x Portable radio systems x Cellular/cordless telephone 2nd Local prescaler and so on. ORDERING INFORMATION PART NUMBER PACKAGE 8 pin plastic SSOP (175 mil) MARKING 1509 SUPPLYING FORM Embossed tape 8 mm wide. Pin 1 is in tape pull-out direction. 1000p/reel. PPB1509GV-E1 Remarks : To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: PPB1509GV) Caution:Electro-static sensitive devices Document No. P10769EJ2V0DS00 (2nd edition) Date Published September 1997 N Printed in Japan (c) 1996 PPB1509GV PIN CONNECTION (Top View) Pin NO. 1 Pin Name VCC1 IN IN GND SW1 SW2 OUT VCC2 1 2 3 4 8 7 6 5 2 3 4 5 6 7 8 PRODUCT LINE-UP y2 Product No. ICC (mA) VCC (V) 2.2 to 3.5 2.2 to 5.5 fin (MHz) 50 to 300 50 to 700 y4 fin (MHz) 50 to 600 50 to 800 y8 fin (MHz) 50 to 1000 50 to 1000 8 pin SOP (225 mil) 8 pin SSOP (175 mil) NEC Original Package Pin Connection PPB587 G PPB1509 GV 5.5 5.0 Remarks This table shows the TYP values of main parameters. Please refer to ELECTRICAL CHARACTERISTICS. PPB587G is discontinued. INTERNAL BLOCK DIAGRAM D IN IN CLK Q D CLK Q D CLK Q OUT Q Q Q SW1 SW2 2 PPB1509GV SYSTEM APPLICATION EXAMPLE One of the example for usage RX DEMO I Q VCO VCO SW /N /N PLL PLL PB1509GV I 0 TX PA 90 Q This block diagram schematically shows the PPB1509GV's location in one of the example application system. The other applications are also acceptable for divider use. 3 PPB1509GV Pin Explanations Applied Pin No. 1 Symbol VCC1 Voltage 2.2 to 5.5 Pin Voltage * Functions and Explanation Power supply pin of a input amplifier and dividers. This pin must be equipped with bypass capacitor (eg 1000 pF) to minimize ground impedance. Signal input pin. This pin should be coupled to signal source with capacitor (eg 1000 pF) for DC cut. Signal input bypass pin. This pin must be equipped with bypass capacitor (eg 1000 pF) to minimize ground impedance. Ground pin. Ground pattern on the board should be formed as wide as possible to minimize ground impedance. Divide ratio control pin. Divide ratio can be determined by following applied level to these pins. SW2 H SW1 H L 1/2 1/4 L 1/4 1/8 2 IN * * 0 1.7 to 4.95 3 IN 1.7 to 4.95 * * 4 GND 5 SW1 H/L 6 SW2 H/L * These pins must be each equipped with bypass capacitor to minimize their impedance. 7 OUT * 1.0 to 4.7 Divided frequency output pin. This pin is designed as emitter follower output. This pin can output 0.1 VP-P min with 200 : load. This pin should be coupled to load device with capacitor (eg 1000 pF) for DC cut. 8 VCC2 2.2 to 5.5 * Power supply pin of output buffer amplifier. This pin must be equipped with bypass capacitor (eg 1000 pF) to minimize ground impedance. 4 PPB1509GV ABSOLUTE MAXIMUM RATINGS PARAMETER Supply voltage Input voltage Total power dissipation SYMBOL VCC Vin PD TA = +25 qC TA = +25 qC, SW1, SW2 pins Mounted on double sided copper clad 50 u 50 u 1.6 mm epoxy glass PWB (TA = +85 qC) CONDITION RATINGS 6.0 6.0 250 40 to +85 55 to +150 UNIT V V mW qC qC Operating ambient temperature Storage temperature TA Tstg RECOMMENDED OPERATING CONDITIONS PARAMETER Supply voltage Operating ambient temperature SYMBOL VCC TA MIN. 2.2 40 TYP. 3.0 +25 MAX. 5.5 +85 UNIT V qC NOTICE ELECTRICAL CHARACTERISTICS (TA = 40 to +85 qC, VCC = 2.2 to 5.5 V) PARAMETERS Circuit current Upper Limit Operating Frequency 1 Upper Limit Operating Frequency 2 SYMBOLS TEST CONDITIONS No signals, VCC = 3.0 V Pin = 20 to 0 dBm Pin = 20 to 5 dBm @ y 2 @y4 @y8 Pin = 20 to 0 dBm Pin = 20 to 5 dBm fin = 50 MHz to 1000 MHz fin = 50 MHz to 500 MHz RL = 200 : Connection in the test circuit Connection in the test circuit MIN. 3.5 500 700 800 1000 * * 20 20 0.1 VCC OPEN or GND VCC OPEN or GND TYP. 5.0 * * * * * * * * 0.2 VCC OPEN or GND VCC OPEN or GND MAX. 5.9 * * * * 50 500 5 0 * VCC OPEN or GND VCC OPEN or GND UNIT mA MHz MHz ICC fin(U)1 fin(U)2 Lower Limit Operating Frequency 1 Lower Limit Operating Frequency 2 Input Power 1 Input Power 2 Output Voltage Divide ratio control input high Divide ratio control input low fin(L)1 fin(L)2 Pin1 Pin2 Vout VIH1 VIL1 MHz MHz dBm dBm VP-P * * Divide ratio control input high Divide ratio control input low VIH2 VIL2 Connection in the test circuit Connection in the test circuit * * 5 PPB1509GV TEST CIRCUIT 1000 pF Power Supply C1 1 C2 2 50 3 C3 Signal Generator 4 GND SW1 5 IN SW2 6 IN OUT 7 VCC1 VCC2 8 C7 High impedance Oscilloscope C6 R1 150 C5 50 C4 Counter (or Spectrum Analizer) EQUIPMENTS Signal Generator (HP-8665A) Counter (HP-5350B) for measuring input sensitivity (Spectrum Analyzer for measuring output frequency) Oscilloscope for measuring output swing (In measuring output power on Spectrum Analyzer, oscilloscope should be turned off.) Divide Ratio Setting SW2 H SW1 H L 1/2 1/4 L 1/4 1/8 H: SW pin should be connected to VCC1 pin. L: SW pin should be opened or connected to GND. 6 PPB1509GV ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD 1P VCC1 VCC2 IN IN C2 C1 C7 OUT C6 R1 OUT C3 C4 C 5 SW2 PB1506/08/09GV SW1 Component List No. C1 to C7 R1 Value 1000 pF 150 : Note Notes for evaluation board (1) 35 Pm thick double sided copper clad 50 u 50 u 0.4 mm polyimide board (2) Back side : GND pattern (3) Solder plated on pattern (4) O O : Through holes (5) : Remove pattern Note For Output load of IC, R1 is determined as follows; R1 + Impedance of measurement equipment = 200 :. The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. The usage and applications of PPB1509GV should be referred to the application note (Document No. P12611E). 7 PPB1509GV CHARACTERISTIC CURVES Circuit Current vs. Supply Voltage 9 8 TA = -40C 7 Circuit Current ICC (mA) 6 5 4 3 2 1 0 0 1 4 2 3 Supply Voltage VCC (V) 5 6 TA = +25C TA = +85C Recommended operating range Divide by 2 mode (Guaranteed operating window: VCC = 2.2 to 5.5 V, TA = -40 to +85C) Input power vs. Input frequency 20 10 0 -10 -20 -30 -40 -50 VCC = 3.0 V VCC = 2.2 V VCC = 3.0 V VCC = 5.5 V VCC = 2.2 V Input power vs. Input frequency 20 10 0 Input power Pin (dBm) TA = +25C TA = -40C TA = +85C Input power Pin (dBm) Guaranteed operating window -10 -20 Guaranteed operating window TA = +85C -30 -40 -50 TA = -40C VCC = 5.5 V TA = +25C -60 10 100 Input frequency fin (MHz) 1000 2000 -60 10 VCC = 3.0 V TA = +25C 100 Input frequency fin (MHz) 1000 2000 8 PPB1509GV Input power vs. Input frequency 20 10 0 Input power Pin (dBm) Input power vs. Input frequency 20 10 TA = +25C TA = -40C TA = +85C TA = +25C TA = +85C TA = -40C Input power Pin (dBm) 0 -10 -20 -30 -40 -50 TA = -40C TA = +25C TA = +85C Guaranteed operating window -10 -20 -30 -40 TA = +25C Guaranteed operating window TA = +85C -50 TA = -40C -60 10 VCC = 2.2 V 100 Input frequency fin (MHz) 1000 2000 -60 10 VCC = 5.5 V 100 Input frequency fin (MHz) 1000 2000 Output voltage swing vs. Input frequency VCC = 3.0 V Pin = 0 dBm 0.3 Output voltage swing VP-P (V) Output voltage swing vs. Input frequency TA = +25C Pin = 0 dBm VCC = 5.5 V TA = +85C TA = +25C TA = +25C Output voltage swing VP-P (V) 0.3 VCC = 3.0 V 0.2 TA = -40C TA = +85C TA = -40C 0.2 VCC = 2.2 V 0.1 0.1 0 10 100 Input frequency fin (MHz) 1000 2000 0 10 100 Input frequency fin (MHz) 1000 2000 Output voltage swing vs. Input frequency TA = -40C Pin = 0 dBm 0.3 Output voltage swing VP-P (V) Output voltage swing vs. Input frequency TA = +85C Pin = 0 dBm 0.3 Output voltage swing VP-P (V) VCC = 5.5 V VCC = 5.5 V VCC = 3.0 V VCC = 3.0 V 0.2 VCC = 2.2 V 0.2 VCC = 2.2 V 0.1 0.1 0 10 100 Input frequency fin (MHz) 1000 2000 0 10 100 Input frequency fin (MHz) 1000 2000 9 PPB1509GV Divide by 4 mode (Guaranteed operating window: VCC = 2.2 to 5.5 V, TA = -40 to +85C) Input power vs. Input frequency 20 10 0 Input power Pin (dBm) Input power vs. Input frequency 20 10 0 Input power Pin (dBm) TA = +85C TA = -40C TA = +25C VCC = 5.5 V VCC = 3.0 V VCC = 2.2 V -10 -20 -30 -40 VCC = 5.5 V Guaranteed operating window -10 -20 -30 -40 -50 -60 10 TA = -40C Guaranteed operating window VCC = 2.2 V TA = +85C -50 -60 10 TA = +25C VCC = 3.0 V VCC = 5.5 V 100 1000 2000 Input frequency fin (MHz) VCC = 3.0 V TA = +25C 100 1000 2000 Input frequency fin (MHz) Input power vs. Input frequency 20 10 0 Input power Pin (dBm) Input power vs. Input frequency 20 10 TA = -40C TA = +85C TA = +25C TA = +85C TA = +25C TA = -40C 0 Input power Pin (dBm) -10 -20 -30 -40 -50 -60 10 VCC = 2.2 V Guaranteed operating window -10 -20 -30 -40 -50 TA = -40C Guaranteed operating window TA = -40C TA = +85C TA = +85C TA = -40C TA = +25C TA = +25C 100 Input frequency fin (MHz) 1000 2000 -60 10 VCC = 5.5 V 100 Input frequency fin (MHz) 1000 2000 10 PPB1509GV Divide by 8 mode (Guaranteed operating window: VCC = 2.2 to 5.5 V, TA = -40 to +85C) Input power vs. Input frequency 20 10 VCC = 5.5 V 0 Input power Pin (dBm) Input power vs. Input frequency 20 10 0 Input power Pin (dBm) TA = +25C TA = -40C TA = +85C Guaranteed operating window VCC = 2.2 V VCC = 3.0 V Guaranteed operating window TA = -40C -10 -20 -30 -40 -50 -60 10 TA = +25C -10 -20 -30 -40 TA = -40C -50 VCC = 2.2 V TA = +85C VCC = 5.5 V VCC = 3.0 V 1000 2000 100 Input frequency fin (MHz) -60 10 VCC = 3.0 V TA = +25C 1000 2000 100 Input frequency fin (MHz) Input power vs. Input frequency 20 10 0 TA = +25C -10 -20 TA = +85C -30 -40 TA = -40C -50 -60 10 VCC = 2.2 V TA = +25C 1000 2000 -60 10 100 Input frequency fin (MHz) -50 TA = -40C Input power Pin (dBm) Input power vs. Input frequency 20 10 0 -10 -20 -30 -40 TA = -40C VCC = 5.5 V TA = +25C 1000 2000 TA = +85C TA = +85C TA = +25C TA = -40C TA = +85C TA = +25C Guaranteed operating window Input power Pin (dBm) Guaranteed operating window 100 Input frequency fin (MHz) 11 PPB1509GV S11 vs. Input Frequency S11 REF 1.0 Units/ 2 200.0 mUnits/ 55.375 - 142.79 VCC1 = VCC2 = 3.0 V, SW1 = SW2 = 3.0 V FREQUENCY MHz MARKER 2 700.0 MHz 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 S11 MAG .929 .898 .866 .840 .834 .819 .803 .792 .787 .771 ANG -6.7 -10.5 -13.6 -15.9 -19.1 -21.9 -24.7 -27.0 -30.0 -32.7 1 2 3 START 0.050000000 GHz STOP 1.000000000 GHz S22 vs. Output Frequency S22 REF 1.0 Units/ 200.0 mUnits/ Z 50 MHz 149.09 + j 14.86 350 MHz 194.21 - j 36.64 START STOP 0.050000000 GHz 0.350000000 GHz 12 PPB1509GV PACKAGE DIMENSIONS (UNIT: mm) 8 PIN PLASTIC SSOP (175 mil) 8 5 Detail of lead end 1 4 4.940.2 3.0 MAX. 3.20.1 3 -3 +7 0.870.2 1.8 MAX. 1.50.1 0.65 0.10.1 0.15-0.05 +0.10 0.50.2 0.3 -0.05 +0.10 0.575 MAX. 0.10 M 0.15 13 PPB1509GV NOTE ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation). (3) Keep the wiring length of the ground pins as short as possible. (4) Connect a bypass capacitor (e.g. 1000 pF) to the VCC pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. PPB1509GV Recommended Soldering method Infrared ray reflow Soldering conditions Package peak temperature: 235qC, Hour: within 30 s. (more than 210qC), Time: 3 times, Limited days: no.* VPS Package peak temperature: 215qC, Hour: within 40 s. (more than 200qC), Time: 3 times, Limited days: no.* Wave soldering Soldering tub temperature: less than 260qC, Hour: within 10 s. Time: 1 time, Limited days: no. Pin part heating Pin area temparature: less than 300qC, Hour: within 3 s./pin Limited days: no.* WS60-00-1 VP15-00-3 IR35-00-3 condition symbol * It is the storage days after opening a dry pack, the storage conditions are 25qC, less than 65% RH. Caution The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). 14 PPB1509GV [MEMO] 15 PPB1509GV ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96. 5 |
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